Zero Void.

LED soldering without air voids. Up to 11 times fewer voids: heat reaches the heat sink, LEDs perform better and last longer.

−91%total void area compared with standard soldering (maximum value)
< 1%area of the largest single void, versus about 10% with standard soldering
11×fewer voids: from 19.4% to 1.7% of the solder area

Voids block
heat dissipation.

In an SMD LED the chip is soldered onto a circuit board that carries the heat away. Small gas-filled pockets, called voids, can remain in the solder: where there is a void, heat cannot pass.

Standard soldering
Exploded LED with standard soldering: large voids

Heat blocked by voids

Zero Void soldering
Exploded LED with Zero Void soldering: minimal voids

Heat flows to the heat sink

Up to 11 times
fewer voids.

The X-ray looks at the solder layer from above. The dark spots are voids: drag the slider to compare.

X-ray of standard soldering: many dark voids X-ray of Zero Void soldering: almost no voids With voids19.4% voidsStandard soldering Zero Void1.7% voidsZero Void soldering
Standard soldering19.4%
Zero Void1.7%

Share of the solder area taken up by voids. Data from X-ray of two samples; images shown in negative for better readability.

Fewer voids:
more efficiency, longer life.

A continuous joint dissipates heat better and spreads stress more evenly: the component runs cooler, performs better and wears more slowly.

Efficiency and temperature

The hotter the LED, the lower its efficiency. With fewer voids heat is dissipated better: Zero Void sits further left on the curve, cooler and more efficient.

ZERO VOIDSTANDARD LOWER TjHIGHER Tj EFFICIENCY

Service life and thermal stress

Stress concentrates at the edges of large voids. With fewer voids the stress at each thermal cycle drops: cracks appear later and service life is longer.

ZERO VOIDSTANDARD LOWER STRESSHIGHER STRESS SERVICE LIFE

More efficiency,
longer service life.

Higher efficiency

The LED runs cooler and performs better.

Lower thermal resistance and junction temperature, fewer hot spots, more thermal headroom.

Longer service life

Less stress on the solder joint, even over many switching cycles.

With fewer voids, the stress caused by thermal expansion does not concentrate: cracks appear later.

More reliability, less waste

Uniform solder joints from batch to batch, more consistent performance.

More effective soldered area: more uniform current, better resistance to vibration and shock.
IPC-A-610 and J-STD-001 Application Specialist certifications

Documented quality, IPC-certified operators. Every result is verified by X-ray; our soldering staff are certified to IPC-A-610 and J-STD-001.

— Let’s talk

Your next project deserves soldering without compromise.

We will show you the test data and help you choose the right solution.